FLUX
|
|
|
|
PACIFIC 2007 |
PACIFIC 2008 |
IF 2005 M |
- VOC free
- halide free
- no residue
- water based
|
- VOC free
- halide free
- no residue
- water based
- for lead-free
|
- halide free
- no residue
- no clean
|
| |
| TS
15 |
TS
18 |
TS
33 |
- halide free
- no clean
- synthetic flux
|
- halide free
- no clean
- synthetic flux
|
- halide free
- no clean
- activated flux
|
| IF
8001 |
IF
8300 Flux Paste |
|
- halide free
- no clean
- for rework
|
- halide free
- no clean
- for rework
|
|
| SOLDER
WIRE |
Interflux® has developed no-clean solder wires
and tools for specific soldering applications.
Interflux® IF 14 core solder was developed as
the safe halogen-free and rosin-free no-clean solution
for solder- wire applications. |
- IF 14-14
- IF 14-10
- IF 14-0.9
- IF 14-0.6
|
| SOLDER
BAR |
High quality solder bars |
| SOLDERING
PRODUCTS |
|
| |
|
|
| |
|
FLUXES
|
|
Flux type |
Solids |
VOC-free |
Foam |
Spray |
Alcohol-based
No-residue fluxes |
IF
2005M |
1,8
% |
No |
Yes |
Yes |
| |
IF
2005C |
3,6% |
No |
Yes |
Yes |
Alcohol-based
No-clean fluxes |
TS 15 |
1,5
% |
No |
Yes |
Yes |
| |
TS
18 |
1,8
% |
No |
Yes |
Yes |
| |
TS
33 |
3,3
% |
No |
Yes |
Yes |
| N2
flux - VOC free |
IF
2007 |
1,8
% |
Yes |
No |
Yes |
N2
flux - VOC free
100% VOC free
No-clean fluxes |
IF 2009 |
2,5% |
Yes |
No |
No |
| |
IF
2008 |
3,7
% |
Yes |
No |
Yes |
| |
IF
2008plus |
4,5
% |
Yes |
No |
Yes |
| |
IF
2009M |
3,7 % |
Yes |
No |
Yes |
| |
IF 2009+P |
4,5% |
Yes |
No |
Yes |
|
|
IF
2010F |
2,5 % |
Yes |
Yes |
Yes |
| Repair |
IF
8001 |
8,6
% |
No |
No |
No |
| Flux
pen |
IF
8001 |
8,6
% |
No |
No |
No |
| Gel
( BGA ) |
IF
8300 |
35
% |
No |
No |
No |
|
|
Flux type |
Flammable |
Odour |
Preheating |
Use |
| No-residue
fluxes |
IF
2005M |
Yes |
Mild |
100
°C - 130°C |
High-end, Automotive,
Medical, Military |
| |
IF
2005C |
Yes |
Mild |
100
°C - 160°C |
High-end lead-free applications |
| No-clean
fluxes |
TS
15 |
Yes |
Mild |
70°C
- 100°C |
Low cost, CEM |
|
|
TS
18 |
Yes |
Mild |
70°C
- 120°C |
Low cost, CEM |
|
|
TS
33 |
Yes |
Mild |
70°C
- 120°C |
Consumer electronics |
| N2
flux - VOC free |
IF
2007 |
No |
None |
85°C
- 110°C |
High-end, Automotive,
Medical, Military |
|
N2 flux
- VOC free
100% VOC free
No-clean fluxes |
IF
2009 |
No |
None |
85°C
- 110°C |
High-end,
Automotive, Medical, Military
|
|
|
IF
2008 |
No |
Strong |
85°C
- 160°C |
Lead-free & selective soldering |
|
|
IF
2008plus |
No |
Strong |
85°C
- 160°C |
Lead-free & selective soldering |
|
|
IF
2009M |
No |
None |
85°C
- 160°C |
High-end, Automotive, Medical, Lead-free |
|
|
IF
2009+P |
No |
Mild |
85°C
- 160°C |
Consumer electronics |
|
|
IF
2010F |
No |
None |
120°C
- 150°C |
All electronic industries |
| Repair |
IF
8001 |
Yes |
Mild |
N.A. |
Repair, ‘mini-wave’
solder tip |
| |
IF
8300 |
No |
Mild |
N.A. |
BGA repair, repair,
‘mini-wave’ solder tip |
 |
Solder
Pastes
Lead Free Solder Pastes
|
|
Specifications |
Flux
type |
Application |
Metal
content
% weight |
Powder
size
following IPC |
|
No clean, rosin free
for closed systems |
IF
9007’ |
Proflow
(Dek)
MPM (Rheopump)
Paste Puck
Dispensing |
89%
89%
89%
84% |
2,
3, 4(*) and 5(*)
2, 3, 4(*) and 5(*)
2, 3, 4(*) and 5(*)
3, 4(*) and 5(*) |
| No clean, rosin free
cleanable |
IF
9009 |
Screenprinting
Dispensing |
89-89,5%
84% |
2,
3, 4(*) and 5(*)
3, 4(*) and 5(*) |
| Lead-free (SnAg),
no clean, rosin free
cleanable |
IF
9009 |
Screenprinting
Dispensing |
88%
82% |
2,
3, 4(*) and 5(*)
3, 4(*) and 5(*) |
|
Lead-free (SnAgCu),
no clean, rosin free |
IF
9008 |
Screenprinting
Dispensing |
86%
82% |
3
3 |
* On request, adapted metal content
possible
| To
IPC J-STD-005 |
Type
1 = 75 – 150µ |
| |
Type 2 = 45 – 75µ |
| |
Type 3 = 25 – 45µ |
| |
Type 4 = 20 – 38µ |
| |
Type 5 = 15 – 25µ |
| Alloys
available |
Melting
point |
Flux
type availability |
| Sn63Pb37 |
183°C |
IF
9007', IF 9009 |
| Sn62Pb36Ag2 |
179°C |
IF
9007', IF9009 |
| LEAD-FREE |
|
|
| Sn96Ag4 |
221°C |
IF
9009 |
| Sn95.5Ag3.8Cu0.7 |
217°C |
IF
9008 |
* Other alloys are available on request
| Packaging
available
for dispensing |
Packaging
available
for screening |
Special
packaging |
| Syringes
of
5 – 10 – 30 cc |
500
gram jars
500 gram cartridges
1000 gram cartridges |
900
gram proflow
cassettes |
 |
SOLDER WIRES
Lead
Free Solder Wires
|
|
Solder
wire type |
product
name |
Flux
type |
Flux
contents
% W/W |
Spool
size
available (*) |
|
No-clean |
IF
14-14 |
IF14 |
1,40
% |
500
gr. |
|
No-clean / Low-residue |
IF
14-10 |
IF
14 |
1,00% |
500
gr. |
|
|
IF
14-09 |
IF14 |
0,90
% |
500
gr. |
|
No-clean / No-residue |
IF
14-06 |
IF14 |
0,60
% |
500
gr. |
|
No-clean /
RMA (**) |
IF
R88 |
R88 |
0,88
% |
500
gr. |
Diameters available: 0,35 - 0,5 - 0,7 - 1,0 - 1,5 (0,35
not available for IF R88)
(*) Diameter 0,35: spool size only available in 100 gram!
(**) contains colophony
|
Alloys
available |
Melting
point |
Available
in IF 14-14 |
Available
in IF 14-09 |
Available
in IF 14-06 |
Available
in IF R88 |
|
Sn60Pb40 |
183-190°C |
Yes |
No |
No |
No |
|
Sn63Pb37 |
183°C |
Yes |
Yes |
Yes |
Yes |
|
Sn62Pb36Ag2 |
179°C |
Yes |
Yes |
Yes |
No |
|
Sn5Pb93.5Ag1.5 |
296-310°C |
Yes |
Yes |
No |
No |
|
LEAD-FREE
|
|
Sn99Cu1 |
227°C |
Yes |
Yes |
No |
No |
|
Sn96Ag4 |
221°C |
Yes |
Yes |
Yes |
No |
|
SnAg3.8Cu0.7 |
217
°C |
Yes |
Yes |
No |
No |
| The Interflux® Titration
Kit is developed to check the solid content of the
Interflux® fluxes. You don't need to
be a rocket scientist to use this kit as we made
it easy to use. The reading gives the activity immediately. |
* Resistant to high temperatures
* Can stay in contact with liquid solder without
breaking
* Fast cooling will not breake the glassplate
* Slight coloration for recognition by optical
sensors
* Clear scale(in centimeters)
|
 |
TEMPERATURE
CONTROL DENSITY METER
|
* High accuracy density:
0.001 g/cm³
* Easy scale to read* Alcohol thermometer: no
mercury!
* Accuracy Temperature: 1ºC , 2ºF
* The measuring of the density and the temperature
at the same time makes the interpretation of the
results easier.
|
F
910 De-oxidation oil (Lead
Free Compatible)
IF Anti-Oxidant pellets (Lead Free Available)
Elimination of :
1. floating particles in the solder
2. poor heat transfer
3. lumpy solder
4. micro bridging
5. dirty PCB’s |
* Higher viscosity
* Higher solids content
* Quicker drying(< 1 hour at room temperature)
* Good adhesion
* Higher heat resistance
* Excellent tensile strength |
 |
LECTRO
LOTION (Handcream with ESD potection)
|
| Alloy |
Melting
range |
Packaging
size |
|
Sn63Pb37
interalloy solderbars |
183°C |
- 25kg box
- ingots for automatic filling |
|
